Description
INTRODUCTION
The history of semiconductor devices starts in 1930’s when Lienfed and Heil first proposed the mosfet. However it took 30 years before this idea was applied to functioning devices to be used in practical applications, and up to the late 1980 this trend took a turn when MOS technology caught up and there was a cross over between bipolar and MOS share. CMOS was finding more wide spread use due to its low power dissipation, high packing density and simple design, such that by 1990 CMOS covered more than 90% of total MOS scale.
Bicmos Technology Seminar Report
Page Length : 30
Content :
- Introduction
- System On Chip Fundamentals
- Active Device Option For Analog And Rf Soc Design
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- Bipolar
- Cmos
- Bicmos
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- Bicmos Process Technology For Rf Digital And Analog Circuits
- Technology Description Of The Standard Submicron Process
- Digital Cmos Core Process
- Dense Sram
- Process Integration Of The Sige Device
- Technology Description Of The Standard Submicron Process
- Passive Component For Fully Integrated Analog And Rf Circuits
- Resistors
- Capacitors
- Inductors
- Varactors
- Bicmos Technology Present And Future
- Conclusion
- References
Bicmos Technology Presentation Report (PPT)
Page Length : 18
Content :
- Introduction
- Abstract
- Characteristics of CMOS Technology
- Characteristics of Bipolar Technology
- Combine advantages in BiCMOS Technology
- BiCMOS Fabrication
- BiCMOS Integrated Circuits
- Advantages of BiCMOS
- Disadvantages of BiCMOS
- Applications of BiCMOS
- Comparison between CMOS and BiCMOS
- BiCMOS Products
- Conclusion
- Literature Survey
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